导料盘结构,申请号TW103202501-传众专利搜索

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发明名称	导料盘结构
摘要
申请公布号	TWM480542	申请公布日期	2014.06.21
申请号	TW103202501	申请日期	2014.02.13
申请人	涂岂铭桃园县八德市和义街18号;李启达新北市莺歌区莺桃路206巷24弄15号;李仲明	发明人	涂岂铭;李启达;李仲明
分类号	B65G49/07	主分类号	B65G49/07
代理机构		代理人
主权项
地址	新北市莺歌区莺桃路129巷12弄8号4楼之1 TW

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