| 摘要 |
The present invention relates to a waterproof compound for semiconductor packages and a method for producing the same. The waterproof compound for the semiconductor packages according to the present invention has a waterproof effect in a case when the semiconductor package is exposed to water or humid air, thereby preventing surface cracking or detachment. Thus, if the semiconductor packages and semiconductor products are manufactured using the waterproof compound for the semiconductor packages and the production method thereof, the semiconductor packages and semiconductor products, of which the state of the surface is not changed even if being exposed to water or humid air, are able to be provided. Also, by using the waterproof compound for the semiconductor packages according to the present invention, tensile strength and bonding strength are increased; and the waterproof effect is excellent, thereby contributing to the improvement of durability and the extension of lifetime of the semiconductor packages. |
