| 摘要 |
The present invention relates to a thermal bonding apparatus for spout pouch to thermally bond a separately manufactured pouch with a spout through: a step of supplying pouches loaded on a pouch supplier (106) by a push bar and a pouch aligner to make the pouches come in contact with each other and be uniformly aligned; a step of successively transferring the pouch which is drawn out by a pouch drawer (110) from the pouch supplier using a transfer unit (140) having a plurality of tongs (122, 124, 126, 128, 130, 132, 134, 136); a step of engaging a spout (138) held from a spout supplier (146) by a spout binder (148) while a bonding hole is stretched by a pouch stretcher (142), and prebonding the spout while the binder hole is closed by the pouch closer (144); a step of thermal bonding and cooling a thermal bonding unit (328) of the prebonded pouch by successively passing through simultaneously operating main binders (152, 154, 156, 158) and a cooler (160); and a step of discharging a thermally bonded pouch (162) by a spout pouch binder (166) to a multi-loaded supply shelf (164) on a spout discharger (168). Therefore, the injection of liquid juice and sealing can be performed by supplying pouches to a typical spout pouch packing apparatus in a separate process. |
