LED PACKAGE AND MENUFACTURING METHOD OF THE SAME

摘要

The present invention relates to an LED package. The LED package includes a substrate; an LED chip mounted on the substrate; a fluorescent resin layer formed in a cavity of the substrate; and a fluorescent sheet stacked on the upper part of the fluorescent resin layer. The fluorescent sheet includes a first resin layer in which a fluorescent substance is dispersed; and a second resin layer which includes a microsphere material. According to an embodiment of the present invention, the total luminous flux, luminous intensity, and color rendering of the LED package are improved.