| 摘要 |
A substrate cutting apparatus according to an embodiment of the present invention includes: a first conveyor part and a second conveyor part which are arranged along a first direction, a transportation direction of a substrate on an installation board, with an interval between them, and comprise a belt which moves as being rotated by being wound around a plurality of rotors under the state that the substrate is placed; a scribe unit which scribes the substrate as being installed in the interval; and a dancer rotor unit which is installed between an upper side second conveyor part corresponding to an upper side of the second conveyor part and a lower side second conveyor part corresponding to a lower side, and comprises at least a pair of first rotor and second rotor. The first rotor is located in the outside of the belt of the second conveyor part, and the second rotor is located in the inside of the belt of the second conveyor part. The first rotor and the second rotor are formed to be able to move along an opposite direction to each other in a second direction intersecting the first direction, and thus the upper side second conveyor part and the lower side second conveyor part formed in a body can be in different operation states. |
