PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a printed circuit board and a manufacturing method thereof. The printed circuit board according to the present invention includes an insulating substrate with a plurality of cavities; elements mounted in each cavity of the insulating substrate; and an insulating layer formed on the insulating substrate to cover the elements and cavities. The distance from the bottom of the cavity to the bottom of the insulating substrate is same as the distance from the top of the element to the top of the insulating layer.