| 摘要 |
Disclosed is a method for detecting an unmounted chip in a substrate. The method for detecting the unmounted chip in the substrate includes: a step for inspecting a chip mounting state in an inspection area (region of interest) inside a measurement area (field of view) which is imaged by a camera; a step for inspecting a first neighboring area which is adjacent to a chip unmounting inspection area in a case when the chip unmounting inspection area, where the chip is not mounted in the inspection area, is found; and a step for stopping the inspection in a case when the unmounted chip is detected in the first neighboring area, and inspecting a second neighboring area which is adjacent to the first neighboring area in a case when the chip is not found in the first neighboring area. |
