| 摘要 |
An epoxy resin composition according to an embodiment of the present invention comprises: an epoxy compound represented by the following chemical formula; a hardening agent; and an inorganic filler including boron nitride (BN). In the chemical formula, R1 to R6 can be independently selected from the group consisting of H, Cl, Br, F, C1-C3 alkyl, C1-C3 alkene, and C1-C3 alkyne, and n is 1, 2, or 3. |
