| 摘要 |
A printed circuit board in accordance with an embodiment of the present invention includes a first layer including a first substrate, which includes a conductive copper foil unit and an insulated non-copper foil unit, a mash unit, and a first ground unit; a second layer including a second substrate including the conductive copper foil unit and the insulated non-copper foil unit and a second ground unit; and a third layer including a third substrate including the conductive copper foil unit and the insulated non-copper foil unit, a third ground unit, and an etching back line. At least one among the first to third layers crosses each other so that the copper foil unit and the non-copper foil unit of each layer are laminated to correspond to each other. |
