SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a semiconductor module which can be easily manufactured. For this, a semiconductor module according to one embodiment of the present invention includes a control part which has at least one control device; and a power part which has at least one power device. The control part and/or the power part include(s) an elastic contact pin. The control part can be electrically connected to the power part by using the contact pin.