| 摘要 |
FIELD: physics, optics.SUBSTANCE: invention relates to an apparatus for laser trimming of resistors, primarily made via thin-film or thick-film technology on polycor, glass-ceramic and ceramic substrates. The apparatus has a working table, a laser emitter (2) with optical and precision XY kinematic systems mounted on XY coordinate tables (5, 6) with Z-microlift probes (7, 8), a digital measuring system (9) with units (10, 11) for positioning and mounting probes on termination pads, a unit (12) for spot positioning and setting the zone and cutting path of the laser emitter. The units (10, 11) for positioning and mounting the probes are connected to a unit (13) for setting the movement zone of the probes. The precision XY kinematic system, controlled by the unit (12), facilitates positioning of the spot of the laser emitter and pre-trimming cutting. The substrate is placed and fixed on the working table. Each of the probes is moved to termination pads of the XY coordinate tables (5, 6), which are controlled by units (10, 11). Data from the probes are measured by the digital measuring system (9). The unit (13) employs a technology of accident-free movement of measuring probes between termination pads.EFFECT: reliable operation of the device and preventing damage to the processed article.11 dwg |
