| 摘要 |
The present invention relates to an antenna plating method using a double injection molding process for forming an antenna on a base member through a preprocessing step, an electroless copper plating step, an electroless nickel plating step, and a sealing step. The preprocessing step before the electroless copper plating step comprises a step (A) of preparing the base member formed by injection molding a circuit pattern on resin in which PC and ABS are mixed; an ultrasonic cleaning step (B) of removing foreign materials stuck on the surface of the base member; a step (C) of adsorbing palladium ions on the surface of the base member etched by chromic acid anhydride and sulfuric acid after the base member passing the step (B) is impregnated and etched in a mixed solution in which the chromic acid anhydride (CrO_3), the sulfuric acid (H_2SO_4), and palladium sulfate (PdSO_4·2H_2O) are mixed; a step (D) of applying a catalyst for adsorbing the palladium ions on the base member by impregnating the base member in a mixed solution in which the palladium sulfate (PdSO_4·2H_2O) and chromic acid are mixed; and a catalyst reduction step (E) of cleaning the base member with water after the base member passing the step (D) is impregnated in a mixed solution in which a reducing agent and caustic soda are mixed; thereby improving the quality of the electroless copper plating at maximum without skip plating while omitting an existing neutralization process. |
