| 摘要 |
The present invention, relating to a method for packaging SAW filters with a high frequency band, comprises a packing process including; (a) a step of dropping an adhesive material into a housing; (b) a step of mounting a high frequency filter on the adhesive material and fixating the high frequency filter within the housing; (c) a step of connecting metallic patterns of the high frequency filter with wires of the housing; (d) a step of heating the bottom of the housing at a set temperature for a set time; and (e) a step of sealing the inner part of the housing by attaching a cover to the upper part of the housing. According to this invention, gas does not get leaked because of thermosetting of epoxy resin even after a finished high frequency filter module is soldered on a PCB so damage to aluminum patterns caused by the gas leaked from the epoxy resin can be prevented. [Reference numerals] (S110) Dropping an adhesive material;(S120) Mounting a SAW filter;(S130) Wiring;(S140) Heating the bottom of a housing;(S150) Attaching a cover |
