METHOD OF PROCESSING SUBSTRATES FOR COATING APPLICATION BY VAPOUR DEPOSITION

摘要

FIELD: process engineering.SUBSTANCE: invention relates to surface processing at de-airing plant with first target-like electrode that makes the part of evaporation source by electric arc and second electrode that doubles as a holder. Arc discharge is fed via first electrode with arc discharge pulse current to evaporate the material from said target to be deposited intermittently on blanks. Second electrode and blanks make the bias electrode. Power supply feeds the bias voltage to bias electrode. Note here that bias voltage is fed in compliance with arc discharge current to ensure ion bombardment of substrate surface at equilibrium state between surface layer formation and its removal.EFFECT: various types of surface processing at zero growth of ply.15 cl, 10 dwg