| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition particularly excellent in surface smoothness and warpage reduction, a prepreg using the same, a laminate, and a multilayer printed wiring board.SOLUTION: There are provided: the thermosetting resin composition containing (A) at least one thermosetting resin selected from an epoxy resin and a cyanate resin, (B) a maleimide compound having at least two N-substituted maleimide groups in one molecule, (C) an amine compound having at least two primary amino groups in one molecule, (D) a monoamine compound having an acidic substituent, and (E) a rheology control agent; the prepreg using the thermosetting resin composition; the laminate; and the multilayer printed wiring board. |
