INSPECTION METHOD AND INSPECTION FIXTURE FOR SCRIBING LINES OF WAFER

摘要

An inspection method and an inspection fixture for the scribing lines of a wafer are disclosed. The inspection method includes the following steps: providing a wafer having multiple chips and a lower surface attached with a dicing tape, wherein scribing lines are formed between the chips; connecting the dicing tape with a transparent carrier supporting a first liquid medium such that the dicing tape is contacted seamlessly with the first liquid medium, wherein the difference of refractive index between the first liquid medium and the dicing tape is less than 0.3; and inspecting the scribing lines through the transparent carrier from below the lower surface of the wafer by an inspection lens of an optical inspector. The inspection method and fixture increase the image resolution of the scribing lines so as to facilitate the detection of lower-surface defects of the scribing lines.

主权项

1. An inspection method for scribing lines of a wafer, comprising the steps of:
providing a to-be-inspected wafer, wherein the to-be-inspected wafer has a plurality of dies, a scribing line formed between each two adjacent said dies, and a lower surface attached with a dicing tape; connecting the dicing tape with a transparent carrier supporting a first liquid medium, wherein the dicing tape is placed on the transparent carrier and is contacted seamlessly with the first liquid medium, and a difference of refractive index between the first liquid medium and the dicing tape is less than 0.3; and inspecting the scribing lines, wherein an inspection lens of an optical inspector is aimed at each said scribing line through the transparent carrier from below the lower surface to inspect the scribing lines.