发明名称 |
ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS |
摘要 |
Disclosed is a method for manufacturing an array substrate, comprising: step A, sequentially forming patterns of a first conduction layer, source and drain electrodes, an active layer, and an insulation layer on one side of the substrate, wherein at least one via hole is provided on the insulation layer; step B, sequentially forming a gate metal layer and a passivation layer on the substrate on which the first conduction layer, the source and drain electrodes, the active layer, and the insulation layer have been formed, wherein the gate metal layer comprises a gate electrode and a gate line, and the gate metal layer is coupled to the first conduction layer through the at least one via hole to form a path for dispersing static electricity. |
申请公布号 |
US2014167051(A1) |
申请公布日期 |
2014.06.19 |
申请号 |
US201314057267 |
申请日期 |
2013.10.18 |
申请人 |
BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. ;BOE TECHNOLOGY GROUP CO., LTD. |
发明人 |
YU HAIFENG;Feng Bin;Lin Hongtao |
分类号 |
H01L27/088;H01L21/8234 |
主分类号 |
H01L27/088 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing an array substrate, comprising:
step A: sequentially forming patterns of a first conduction layer, source and drain electrodes, an active layer, and an insulation layer on one side of the substrate, wherein at least one via hole is provided on the insulation layer; and step B: sequentially forming a gate metal layer and a passivation layer on the substrate on which the first conduction layer, the source and drain electrodes, the active layer, and the insulation layer have been formed, wherein the gate metal layer comprises a gate electrode and a gate line, and the gate metal layer is coupled to the first conduction layer through the at least one via hole to form a path for dispersing static electricity.
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地址 |
BEIJING CN |