| 摘要 |
The invention relates to a method for producing a switching module (20), which comprises at least one electronic component (22) and at least one heat sink (24) for cooling the at least one electronic component (22), the at least one electronic component (22) being coupled with the at least one heat sink (24) and being at least partly overmolded with a plastic (26). The invention further relates to a corresponding method for producing a grid module (10) and to a grid module produced by the method of the invention, and to a corresponding electronic subassembly having such a grid module. According to the invention, the at least one electronic component (22) and the at least one heat sink (24) are inserted into an injection mold (30), wherein a spring element (32) is arranged between the at least one electronic component (22) and an inner side (34) of the injection mold (30), wherein the spring element (32) is supported on the inner side (34) of the injection mold (30) such that the at least one heat sink (24) is pressed against a wall (36) of the injection mold (30). |
