<p>A semiconductor device is disclosed. The semiconductor device includes a semiconductor structure which has a first line which is extended from an upper part to a first direction, a first insulating layer which covers the semiconductor structure, a via plug which penetrates the first insulating layer, and a second line which is extended to a second direction which has a preset angle to the first direction on the first insulating layer, and is connected to the first line by the via plug. The second line has a protruding portion which protrudes from at least one among the first and second parts at the boundary of the first and the second parts.</p>
