| 摘要 |
Laser light emitted from a laser light source is concentrated in accordance with a planned glass substrate cutting line by a cylindrical lens provided in a circular form. The position in which the laser light is irradiated with respect to the cylindrical lens is moved in a first direction by a drive device. Within a plane orthogonal to the optical axis, the width (W5) of the laser light in a second direction perpendicular to the first direction is greater than the width (W7) of the cylindrical lens. In a process for moving the irradiation position of the laser light in the first direction using a drive device, a machining mark corresponding to the planned cutting line is formed through a plurality of emissions of the laser light from the laser light source. Consequently, an endless closed-shape machining mark is easily formed on the glass substrate, and the processing time for splitting the glass substrate can be reduced. |
