| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board manufacturing method which enables continuous production without performing single wafer production when an insulation layer of the multilayer printed wiring board is formed by a prepreg.SOLUTION: A multilayer printed wiring board manufacturing method comprises the following processes of: (1) transporting an adhesive sheet in which a prepreg is formed on a support film from a rolled adhesive sheet where the adhesive sheet is rolled and arranging the adhesive sheet in a manner such that a prepreg side is brought into contact with both surfaces or a single surface of the circuit board; (2) temporarily bonding the adhesive sheet to the circuit board by partially adhering the adhesive sheet to the circuit board by applying heat and pressure to a part of the adhesive sheet from the support film side, and subsequently cutting the adhesive sheet depending on the size of the circuit board by a cutter; (3) applying heat and pressure to the temporarily bonded adhesive sheet under a reduced pressure to laminate the adhesive sheet on the circuit board; (4) thermosetting the prepreg to form an insulation layer; and (5) peeling the support film after the thermosetting process. |
