| 发明名称 |
APPARATUS AND METHOD TO MONITOR DIE EDGE DEFECTS |
| 摘要 |
Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die. |
| 申请公布号 |
US2014168879(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201213713935 |
申请日期 |
2012.12.13 |
| 申请人 |
Xie Mayue;Wang Zhiyong;Chen Yuan-Chuan Steven |
发明人 |
Xie Mayue;Wang Zhiyong;Chen Yuan-Chuan Steven |
| 分类号 |
H01L23/544;G06F1/18;H01L23/48 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus comprising:
an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.
|
| 地址 |
Phoenix AZ US |
