CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

A ceramic substrate is provided that includes a ceramic substrate main body having a principal surface, and a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder. The connecting terminal portion includes a copper layer and a coating metal layer covering a surface of the copper layer. The ceramic substrate includes a contact layer disposed between the ceramic substrate main body and the copper layer. The contact layer includes one of a nickel-chromium alloy, chromium, molybdenum, and palladium, and is set back from a side surface of the copper layer in a substrate plane direction.

主权项

1. A ceramic substrate, comprising:
a ceramic substrate main body having a principal surface;a connecting terminal portion disposed on the principal surface of the ceramic substrate main body for connection to a component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; and
a contact layer disposed between the ceramic substrate main body and the copper layer, the contact layer including one of a nickel-chromium alloy, chromium, molybdenum, and palladium, wherein the contact layer is set back from a side surface of the copper layer in a substrate plane direction.