发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN
摘要 <p>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has excellent electrical insulation properties, heat resistance, mechanical strength and electrical characteristics, and is capable of forming a high-resolution circuit pattern.SOLUTION: The positive photosensitive resin composition contains a polyhydroxyamide resin (A) containing a repeating unit represented by formula (1) and a compound (B) which generates an acid by the action of light. In the formula, Y represents an organic group containing at least one aromatic group substituted by a carboxyl group.</p>
申请公布号 JP2014111771(A) 申请公布日期 2014.06.19
申请号 JP20130267352 申请日期 2013.12.25
申请人 NISSAN CHEM IND LTD 发明人 EBARA KAZUYA;SUZUKI HIDEO;TAMURA TAKAYUKI
分类号 C08G69/26;G03F7/023;G03F7/075;H01L21/027 主分类号 C08G69/26
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