SOLUBLE POLYIMIDE, METHOD FOR PRODUCING PATTERNED CURED FILM USING THE SOLUBLE POLYIMIDE AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a polyimide compound which imparts sufficient mechanical characteristics even when subjected to heat treatment at a low temperature below 250°C.SOLUTION: There is provided a polyimide having a structural unit represented by the following formula. X is a n-methylenebisoxycarbonyl group (-COO(CH)OCO-) and may have a substituent; n is an integer of 1 to 10; Y is one of a plurality of groups selected from a di(trifluoromethyl)methylene group (-C(CF)-), a sulfonyl group (-SO-), a carbonyl group (-CO-), a dimethylmethylene group (-C(CH)-), an oxymethylene group (-CHO-) and a methylene group (-CH-) and may have a substituent.