| 发明名称 |
LAMINATION OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS |
| 摘要 |
This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods. |
| 申请公布号 |
US2014170411(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201414187453 |
申请日期 |
2014.02.24 |
| 申请人 |
E I DU PONT DE NEMOURS AND COMPANY |
发明人 |
BIDWELL LARRY ALAN;Champ Michael J.;Crumpton John C.;Dorfman Jay Robert |
| 分类号 |
H01B1/22 |
主分类号 |
H01B1/22 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electrical device comprising an electrical conductor formed from a polymer thick film solder alloy conductor composition, wherein said electrical conductor has been subjected to lamination.
|
| 地址 |
Wilmington DE US |
