ASSEMBLY FOR OPTICAL BACKSIDE FAILURE ANALYSIS OF FLIP-CHIPS DURING ELECTRICAL TESTING

摘要

A method and apparatus for testing a digital device. An apparatus for facilitating testing a digital device comprises a flat-top socket and a flat-top carrier board. The flat-top socket has a recess for accepting a carrier board, the recess having electrical contacts disposed in a pattern matching a pattern on a digital device. The flat-top carrier board also has a pattern of electrical contacts that match those on a digital device. A further embodiment provides an apparatus for facilitating testing of a digital device. The apparatus includes a digital device electrically and mechanically attached to a flip-chip carrier and also includes a flip-chip socket having an interface for connecting with the flip-chip carrier and an existing socket.

主权项

1. An apparatus for facilitating testing of a digital device, comprising:
a flip chip socket having a recess for accepting a carrier board, the recess having electrical contacts disposed in a pattern matching a pattern on a digital device; and a flat-top carrier board having electrical contacts disposed in a pattern matching the pattern of the digital device electrically connected to the digital device.