SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

The present invention provides a multichip package in which a first semiconductor chip having an RF analog circuit area and a digital circuit area, and a second semiconductor chip having a digital circuit area are plane-arranged over an organic multilayer wiring board and coupled to each other by bonding wires. In the multichip package, the first semiconductor chip is made thinner than the second semiconductor chip.

主权项

1. A semiconductor integrated circuit device comprising:
(a) an organic multilayer wiring board having a chip mounting surface and an external land arrangement surface; (b) a first semiconductor chip mounted over the chip mounting surface and having an analog circuit area and a first digital circuit area; (c) a second semiconductor chip mounted over the chip mounting surface and having a second digital circuit area; and (d) a plurality of bonding wires which interconnect between a plurality of terminals provided over respective surfaces of the first and second semiconductor chips, wherein the thickness of the first semiconductor chip is thinner than the thickness of the second semiconductor chip.