LOW PARASITIC PACKAGE SUBSTRATE HAVING EMBEDDED PASSIVE SUBSTRATE DISCRETE COMPONENTS AND METHOD FOR MAKING SAME

摘要

One feature pertains to a multi-layer package substrate of an integrated circuit package that comprises a discrete circuit component (DCC) having at least one electrode. The DCC is embedded within an insulator layer, and a via coupling component electrically couples to the electrode. A first portion of the via coupling component extends beyond a first edge of the electrode, and a plurality of vias each having a first end couple to the first via coupling component. At least a first via of the plurality of vias couples to the first portion of the via coupling component that extends beyond the first edge of the electrode. Moreover, the plurality of vias each have a second end that electrically couple to a first outer metal layer, and at least a second portion of the via coupling component is positioned within a first inner metal layer.

主权项

1. A multi-layer package substrate of an integrated circuit package, comprising:
a discrete circuit component (DCC) having at least one electrode, the DCC embedded at least partially within an insulator layer; a first via coupling component electrically coupled to the electrode, a first portion of the first via coupling component extending beyond a first edge of the electrode; and a plurality of vias each having a first end coupled to the first via coupling component, at least a first via of the plurality of vias coupled to the first portion of the first via coupling component extending beyond the first edge of the electrode.