Methods and Apparatus of Packaging with Interposers

摘要

Methods and apparatus for forming a semiconductor device package on an interposer using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, where a micro-bump is used as a vertical connection between a die and the interposer, and a micro-bump line is used as a horizontal connection for signal transmission between different dies above the interposer. The micro-bump lines may be formed at the same time as the formation of the micro-bumps with little or no additional cost.

主权项

1. A device, comprising:
an interposer with a surface formed by an insulator layer, and a first contact pad covering an opening of the insulator layer and in contact with a metal layer within the interposer; a first die and a second die above the interposer; and a micro-bump layer comprising a first micro-bump line above the insulator layer of the interposer and a micro-bump above the first contact pad of the interposer, wherein the first micro-bump line electrically connects the first die and the second die, and the micro-bump electrically connects the first die to the metal layer within interposer.