Semiconductor Cooling Device

摘要

A system and a method of self-cooling a semiconductor package are described. A cell is formed, which contains a thermally conductive and electrically insulative material, sandwiched between a first thermally conductive plate and a second thermally conductive plate. A plurality of integrated circuits are formed by combinatorial processing. The plurality of integrated circuits are interconnected into a semiconductor integrated circuit package. The cell is thermally bonded to the semiconductor integrated circuit package. The first thermally conductive plate is electrically connected to the semiconductor integrated circuit package. A current is supplied to the second thermally conductive plate by an electrical lead from a supply voltage. Power is provided in series to the semiconductor integrated circuit package and through the cell.

主权项

1. A self-cooling semiconductor device, comprising:
a semiconductor substrate comprising a plurality of transistors; a first electrically conductive plate thermally bonded to the semiconductor substrate; a second electrically conductive plate; and a semiconductor material located between the first electrically conductive plate and the second electrically conductive plate; a first electrical lead from the first electrically conductive plate coupled to a semiconductor junction of the semiconductor substrate; and a second electrical lead from the second electrically conductive plate coupled to a supply voltage, wherein the first electrical lead and the second electrical lead are coupled in series.