| 发明名称 |
HOLLOW SEALING STRUCTURE |
| 摘要 |
A hollow sealing structure includes a substrate, an element part provided on a first surface of the substrate, a cap that covers the element part, and a resin layer that covers the cap. The substrate includes a positioning part positioning the cap. The cap includes a fixation part being arranged at the positioning part and fixing the cap on the substrate. The resin layer is connected to the positioning part and the fixation part. |
| 申请公布号 |
US2014166352(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201214232591 |
申请日期 |
2012.09.21 |
| 申请人 |
NEC Corporation |
发明人 |
Ueda Takashi;Tago Masamoto |
| 分类号 |
H05K5/06 |
主分类号 |
H05K5/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A hollow sealing structure comprising a substrate, an element part provided on a first surface of the substrate, a cap that covers the element part, and a resin layer that covers the cap, wherein:
the substrate includes a positioning part positioning the cap; the cap includes a fixation part being arranged at the positioning part and fixing the cap on the substrate; and the resin layer is connected to the positioning part and the fixation part.
|
| 地址 |
Tokyo JP |
