| 摘要 |
The present invention relates to a memory card system which may comprise a flexible integrated circuit element package, a flexible upper case, a flexible lower case, a wiring structure, an anisotropic conductive film and so on. The integrated circuit element package may include a bendable material, and may have a connection pad. The upper case may include a bendable material, and may cover the flexible integrated circuit element package. The lower case may include a bendable material, and may enable the flexible integrated circuit element package to be fixed thereto. The wiring structure may include a bendable material, and may include a connection wire arranged on the inner surface of the upper case, a connection pin arranged on the outer surface of the upper case, and a via wire penetrating through the upper case. The anisotropic conductive film may be interposed between the integrated circuit element package and the upper case, and may electrically interconnect the connection pad and the connection wire. |
