发明名称 |
Manufacturing method |
摘要 |
Manufacturing method A method of manufacturing a moulded part (10) with one or more integral electronic components (10a). The method includes forming one or more layers (11) in a mould of a moulding apparatus, the one or more layers including the one or more electronic components, and introducing material into the mould to form the moulded part with the one or more integral electronic components. (Figure 1) |
申请公布号 |
WO2014091197(A1) |
申请公布日期 |
2014.06.19 |
申请号 |
WO2013GB53118 |
申请日期 |
2013.11.26 |
申请人 |
THE UNIVERSITY OF WARWICK |
发明人 |
GOODSHIP, VANNESSA;MIDDLETON, BETHANY;CHERRINGTON, RUTH |
分类号 |
H01L51/56;B29C45/14;H01L23/29 |
主分类号 |
H01L51/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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