GAPPED ATTACHMENT STRUCTURES

摘要

Attachment structures for electrically coupling a microelectronic package to a microelectronic board/interposer including joint pads formed on the microelectronic board/interposer which provide a gap between respective openings in a solder resist layer of the microelectronic substrate and each of the joint pads. Such attachment structures may reduce or substantially eliminate contact between a solder interconnect and a solder resist layer of the microelectronic board/interposer, which may, in turn, reduce or substantially eliminate the potential of crack initiation and propagation at contact areas between the solder interconnect and a solder resist layer of the microelectronic board/interposer due to stresses induced by a mismatch of thermal expansion between the microelectronic package and the microelectronic board/interposer during thermal cycling. Further, the connection area between the pad and outside circuitry may be maximized, so that the impact to electrical performance due to the pad design may be minimized.

主权项

1. An microelectronic structure, comprising:
a microelectronic board/interposer; and at least one attachment structure including:
a joint pad disposed on the microelectronic board/interposer having an opening defined therethrough; anda solder resist material layer disposed on the microelectronic board/interposer having an opening defined therethrough that exposes at least a portion of the joint pad;wherein the joint pad opening and the solder resist material layer opening define a gap between the joint pad and the solder resist material layer extending adjacent a periphery of solder resist material layer opening and along about 50% to 75% of the solder resist material layer opening periphery.