EMBEDDED PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

An embedded package in which active elements, such as semiconductor chips, are embedded within a package substrate. The semiconductor chips, embedded within a dielectric layer, are coupled with circuit wires to ensure electrical and signal continuity.;When connections between the semiconductor chip and the package substrate are performed in different directions, there is a reduction in overall interconnection area, connection reliability is improved, leakage currents are reduced, and higher device yields can be realized.

主权项

1. An embedded package, comprising:
a package substrate having circuit wire patterns disposed thereon; a semiconductor chip formed over the package substrate; dielectric layers having metal patterns formed thereon, the dielectric layers configured to cover the semiconductor chip; and first and second connection wire patterns, wherein the first connection wire pattern electrically connects the circuit wire patterns on the package substrate and the semiconductor chip, while the second wire pattern electrically connects the metal patterns and the semiconductor chip.