INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSFERABLE TRACE LEAD FRAME

摘要

System and method of manufacturing an integrated circuit packaging system using transferable trace lead frame. A lead frame is provided having lower metal contacts. A masking layer can be formed on an upper surface of the lead frame for protection and shielding purposes. Routing layer and conductive lands may subsequently be formed by shaping the lead frame, along with bottom encapsulation. The masking layer may subsequently be removed for additional processing steps including connecting an integrated circuit die to the upper surface of the lead frame.

主权项

1. A method comprising:
(a) providing a lead frame having a contact on a lower surface of the lead frame and metal connectors on an upper surface of the lead frame; (b) forming a masking layer over the upper surface of the lead frame and the metal connectors; (c) forming a routing layer having a conductive land on the contact by shaping the bottom surface of the lead frame; (d) forming a bottom encapsulation on the conductive land with the contact exposed from the bottom encapsulation; (e) removing the masking layer from the upper surface of the lead frame; (f) forming an insulation cover directly on a portion of the metal connectors; and (g) connecting an integrated circuit die to the upper surface of the lead frame, the integrated circuit die spaced away from the insulation cover.