THREE DIMENSIONAL CAPACITOR

摘要

Integrated capacitor structures and methods for fabricating same are provided. In an embodiment, the integrated capacitor structures exploit the capacitance that can be formed in a plane that is perpendicular to that of the substrate, resulting in three-dimensional capacitor structures. This allows for integrated capacitor structures with higher capacitance to be formed over relatively small substrate areas. Embodiments are suitable for use by charge pumps and can be fabricated to have more or less capacitance as desired by the application.

主权项

1. A capacitor structure, comprising:
a substrate; a first conductor disposed over the substrate, the first conductor having a top surface, a first sidewall, and a second sidewall; a dielectric layer disposed over the first conductor, the dielectric layer covering the first sidewall and the second sidewall of the first conductor; and a second conductor disposed over the dielectric layer, the second conductor having a first portion disposed along the first sidewall of the first conductor and a second portion disposed along the second sidewall of the first conductor.