| 发明名称 |
Semiconductor Device Having an Identification Mark |
| 摘要 |
A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The identification mark includes an information about a property of the chip. |
| 申请公布号 |
US2014167272(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201213716004 |
申请日期 |
2012.12.14 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Martens Stefan;Schuderer Berthold;Vaupel Mathias;Peichl Raimund |
| 分类号 |
H01L23/544;H01L21/48 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a chip; a contact pad arranged over a front side of the chip; and an identification mark arranged over the contact pad, wherein the identification mark comprises information about a property of the chip.
|
| 地址 |
Neubiberg DE |
