Crack Stop Barrier and Method of Manufacturing Thereof

摘要

A wafer is disclosed. The wafer comprises a plurality of chips and a plurality of kerfs. A kerf of the plurality of kerfs separates one chip from another chip. The kerf comprises a crack stop barrier.

主权项

1. A wafer comprising:
a kerf junction comprising a first kerf and second kerf, the first kerf having a first main direction and the second kerf having a second main direction, the first kerf separating a first chip and a second chip on a first side of the second kerf and the first kerf separating a third chip and a fourth chip on a second side of the second kerf; and a first continuous crack stop barrier having a third direction, wherein the third direction is different than the first main direction, wherein the first continuous crack stop barrier is located in the kerf junction, and wherein the first continuous crack stop barrier extends over a width of the first kerf but does not connect to the first chip and the second chip.