METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

摘要

Disclosed herein is a method of manufacturing a printed circuit board, the method including: (a) performing a hole processing process on one surface of a core layer to process a first via hole having a predetermined height hl; (b) performing a plating process on one surface of the core layer to form a first via electrode in the first via hole and form a first metal layer on one surface of the core layer; (c) performing a hole processing process on the other surface of the core layer to process a second via hole having a predetermined height h2 exposing a lower surface of the first via electrode to the outside; and (d) performing a plating process on the other surface of the core layer to form a second via electrode in the second via hole and form a second metal layer on the other surface of the core layer.

主权项

1. A printed circuit board, comprising:
a core layer; a first via electrode filled and formed in a first via hole having a predetermined height h1 formed on one surface of the core layer; and a second via electrode formed on the other surface of the core layer and filled and formed in a second via hole having a predetermined height h2 exposing a lower surface of the first via electrode to the outside.