发明名称 |
POLISHING PAD AND METHOD FOR PRODUCING SAME |
摘要 |
<p>Provided are: a polishing pad which is capable of alleviating a scratch problem that occurs when a conventional hard (dry) polishing pad is used, and which is excellent in polishing rate and polishing uniformity and is usable not only for primary polishing but also for finish polishing; and a method for producing the polishing pad. The polishing pad is for polishing a semiconductor device and includes a polishing layer having a polyurethane-polyurea resin molded body containing cells of a substantially spherical shape. The polyurethane-polyurea resin molded body has a ratio of closed cells of 60 to 98%. The polyurethane-polyurea resin molded body has a ratio tan´ of a loss modulus E" to a storage modulus E' (loss modulus/storage modulus) of 0.15 to 0.30. The storage modulus E' is 1 to 100 MPa. The polyurethane-polyurea resin molded body has a density D of 0.4 to 0.8 g/cm 3 .</p> |
申请公布号 |
KR20140075795(A) |
申请公布日期 |
2014.06.19 |
申请号 |
KR20147012877 |
申请日期 |
2012.10.12 |
申请人 |
FUJIBO HOLDINGS, INC. |
发明人 |
ITOYAMA KOUKI;MIYAZAWA FUMIO |
分类号 |
H01L21/304;B24B37/20;B24B37/24;C08G18/32 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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