发明名称 |
PROCESSES FOR PREPARING CURED FILMS, THE RESULTING FILMS, AND PLASMA-INITIATED POLYMERIZABLE COMPOSITIONS |
摘要 |
Provided are novel plasma-assisted processes for preparing cured films having excellent heat resistance and moisture resistance.;A process for preparing a cured film, comprising at least: applying a composition containing (A) at least one conductive polymer precursor on a substrate to form a coating layer, and irradiating the coating layer with a plasma to polymerize the conductive polymer precursor (A). |
申请公布号 |
US2014170405(A1) |
申请公布日期 |
2014.06.19 |
申请号 |
US201414188884 |
申请日期 |
2014.02.25 |
申请人 |
FUJIFILM Corporation |
发明人 |
MAKINO Masaomi;INAGAKI Yoshio |
分类号 |
C08J5/18 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
1. A process for preparing a cured film, comprising at least:
applying a composition containing (A) at least one conductive polymer precursor on a substrate to form a coating layer, and then irradiating the coating layer with a plasma to polymerize the conductive polymer precursor (A).
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地址 |
Tokyo JP |