| 发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
| 摘要 |
Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction. |
| 申请公布号 |
US2014167095(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201314105439 |
申请日期 |
2013.12.13 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
KIM Byung Mok;NO Young Jin;KANG Bo Hee;KODAIRA Hiroshi |
| 分类号 |
H01L33/62 |
主分类号 |
H01L33/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device package comprising:
a package body including at least one electrode pad disposed on a surface thereof; and a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, and a bonding ball is disposed on the stitch.
|
| 地址 |
Seoul KR |
