| 摘要 |
PROBLEM TO BE SOLVED: To provide a shield film capable of preventing problems due to bonding with excessively large adhesive force or excessively small adhesive force, by controlling the adhesive force of a separate film for a protective layer appropriately, and to provide a shield printed wiring board, and a method of manufacturing the shield printed wiring board.SOLUTION: On the side of a separate film 6a, having irregularities 61 formed entirely on one side, where the irregularities 61 are formed, a protective layer 7 is formed by performing resin coating via a release layer 6b. Furthermore, an electromagnetic wave shield layer 8 is formed, and the surface roughness (Ra) of the protective layer 7 (hard layer 7a) when the separate film 6a is peeled off from the protective layer 7 is 0.2-1.0μm, in a shield film 1. |
