| 发明名称 |
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices |
| 摘要 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices are disclosed. In one embodiment, a semiconductor device includes a substrate and conductive traces disposed over the substrate. Each of the conductive traces has a bottom region proximate the substrate and a top region opposite the bottom region. The top region has a first width and the bottom region has a second width. The second width is greater than the first width. |
| 申请公布号 |
US2014167253(A1) |
申请公布日期 |
2014.06.19 |
| 申请号 |
US201213719019 |
申请日期 |
2012.12.18 |
| 申请人 |
Manufacturing Company, Ltd. Taiwan Semiconductor |
发明人 |
Tseng Yu-Jen;Lin Yen-Liang;Kuo Tin-Hao;Chen Chen-Shien;Lii Mirng-Ji |
| 分类号 |
H01L23/528;H01L21/768;H01L23/00;H01L23/532 |
主分类号 |
H01L23/528 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a substrate; and a plurality of conductive traces disposed over the substrate, wherein each of the plurality of conductive traces comprises a bottom region proximate the substrate and a top region opposite the bottom region, wherein the top region comprises a first width, wherein the bottom region comprises a second width, and wherein the second width is greater than the first width.
|
| 地址 |
US |
