SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS USING THE SAME

摘要

A semiconductor package includes a flexible base film having a first surface opposing a second surface, a semiconductor chip mounted on the first surface of the base film, and a touch sensing structure including at least one conductive pattern adjacent to the semiconductor chip. The at least one conductive pattern is disposed through the base film and has a surface exposed at the second surface of the base film. A contact condition of the semiconductor package is determined based on detection of a conductive path between the at least one conductive pattern and a conductive frame or support surface of the semiconductor package. The contact condition provides an indication of heat dissipation that may be expected to occur for the chip during operation.

主权项

1. A semiconductor package, comprising:
a flexible base film having a first surface opposing a second surface; a semiconductor chip mounted on the first surface of the base film; and a touch sensing structure including at least one conductive pattern adjacent to the semiconductor chip, the at least one conductive pattern being disposed through the base film and having a surface exposed at the second surface of the base film.