| 摘要 |
A semiconductor device includes a resin package, a semiconductor element, a sealing resin, and a metal terminal. The sealing resin is filled into the resin package to seal the semiconductor element and the insulating substrate. The metal terminal is extended from the inside of the resin package to the outside of the resin package and electrically is connected to the semiconductor element inside of the resin package. The metal terminal has a busbar mounting portion provided with a hole for a bolt to pass therethrough and configured by a parallel planar body on the top surface of the resin package including the resin top plate, a lead portion connected to the busbar mounting portion extended in a direction perpendicular to the surface of the heat sink, and a spring structure having a bias in a direction perpendicular to the surface of the resin package in the busbar mounting portion. |
| 主权项 |
1. A semiconductor device, comprising:
a package having a heat sink, a case surrounding a perimeter of the heat sink, and a top plate separated from the heat sink and positioned overlying the heat sink; a semiconductor element provided on the heat sink through an intervening insulating substrate; a sealant in the package; and a metal terminal extended from within the package to the exterior of the package and electrically connected to the semiconductor element at a location within the package, wherein the metal terminal includes:
a busbar mounting portion comprising a planar body extending over the surface of the top plate and provided with an aperture for a fastener to pass therethrough,a lead portion extending through the top plate and connected to the busbar mounting portion, anda spring structure, biasable in a direction perpendicular to the surface of the top plate, in the busbar mounting portion.
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