发明名称 |
ELECTRONIC CIRCUIT ARRANGEMENT |
摘要 |
An electronic circuit arrangement in accordance with some embodiments has a substrate, the substrate including: a plurality of metallization layers located one above the other; a single fuse-link via coupled between a first metallization layer and a second metallization layer of the plurality of metallization layers, wherein the single fuse-link via is in the form of an electrical fuse link preferentially programmable by applying a sufficiently large current to melt or degenerate the fuse link; a plurality of through-contact vias coupled in parallel between a third metallization layer and a fourth metallization layer of the plurality of metallization layers, wherein the through-contact vias form a through-contact between the third and fourth metallization layers; and electrical circuit components, arranged in a circuit layer, which are electrically coupled to one another by means of the single fuse-link via and by means of the plurality of through-contact vias. |
申请公布号 |
US2014167215(A1) |
申请公布日期 |
2014.06.19 |
申请号 |
US201414188761 |
申请日期 |
2014.02.25 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Barth Hans-Joachim;Rusch Andreas;Schruefer Klaus |
分类号 |
H01L23/525 |
主分类号 |
H01L23/525 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic circuit arrangement having a substrate, the substrate comprising:
a plurality of metallization layers located one above the other; a single fuse-link via coupled between a first metallization layer and a second metallization layer of the plurality of metallization layers, wherein the single fuse-link via is in the form of an electrical fuse link preferentially programmable by applying a sufficiently large current to melt or degenerate the fuse link; a plurality of through-contact vias coupled in parallel between a third metallization layer and a fourth metallization layer of the plurality of metallization layers, wherein the through-contact vias form a through-contact between the third and fourth metallization layers; and electrical circuit components, arranged in a circuit layer, which are electrically coupled to one another by means of the single fuse-link via and by means of the plurality of through-contact vias.
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地址 |
Neubiberg DE |