发明名称 |
PLANE GRINDING PROCESSING METHOD USING HOT MELT ADHESIVE, MAGNET CHUCK WITH GROOVE FOR PLANE GRINDING, AND HOLDING PLATE WITH GROOVE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a grinding processing method using a hot meld adhesive, a magnet chuck with a groove for plane grinding or a plate with a groove capable of performing grinding process with high accuracy of objects to be ground which are one or more magnetic materials or non-magnetic materials and which have various types of shape respectively at a low cost.SOLUTION: Objects 2 to be ground (mainly, non-magnetic materials) mounted on a magnet chuck for plane processing or a vacuum chuck are fixed by a hot melt adhesive 1 or the objects to be ground are mounted on an upper surface of a magnet chuck with a groove 6 or a plate with a groove so as to be fixed by the hot melt adhesive 1 for performing grinding processing.</p> |
申请公布号 |
JP2014111298(A) |
申请公布日期 |
2014.06.19 |
申请号 |
JP20130127930 |
申请日期 |
2013.06.03 |
申请人 |
FUJI SEIKI SEISAKUSHO:KK |
发明人 |
SAITO MINORU |
分类号 |
B24B41/06;B23Q3/08;B23Q3/15 |
主分类号 |
B24B41/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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