发明名称 PLANE GRINDING PROCESSING METHOD USING HOT MELT ADHESIVE, MAGNET CHUCK WITH GROOVE FOR PLANE GRINDING, AND HOLDING PLATE WITH GROOVE
摘要 <p>PROBLEM TO BE SOLVED: To provide a grinding processing method using a hot meld adhesive, a magnet chuck with a groove for plane grinding or a plate with a groove capable of performing grinding process with high accuracy of objects to be ground which are one or more magnetic materials or non-magnetic materials and which have various types of shape respectively at a low cost.SOLUTION: Objects 2 to be ground (mainly, non-magnetic materials) mounted on a magnet chuck for plane processing or a vacuum chuck are fixed by a hot melt adhesive 1 or the objects to be ground are mounted on an upper surface of a magnet chuck with a groove 6 or a plate with a groove so as to be fixed by the hot melt adhesive 1 for performing grinding processing.</p>
申请公布号 JP2014111298(A) 申请公布日期 2014.06.19
申请号 JP20130127930 申请日期 2013.06.03
申请人 FUJI SEIKI SEISAKUSHO:KK 发明人 SAITO MINORU
分类号 B24B41/06;B23Q3/08;B23Q3/15 主分类号 B24B41/06
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